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 October 2003 rev 1.0
ASM3X2105A
Features
FCC approved method of EMI attenuation. Generates a 1X or 1/2 X low EMI spread spectrum clock of the input frequency. Input frequency range: 6MHz to 10 MHz. Internal loop filter minimizes external components and board space. Frequency deviation: Maximum 1%. SSON# control pin for spread spectrum enable and disable options. Low cycle-to-cycle jitter. 5.0V 5% operating voltage range. TTL or CMOS compatible outputs. Ultra-low power CMOS design. Available in 8-pin SOIC and TSSOP.
signals. The ASM3X2105A allows significant system cost savings by reducing the number of circuit board layers ferrite beads, shielding and other passive components that are traditionally required to pass EMI regulations. The ASM3X2105A uses the most efficient and optimized modulation profile approved by the FCC and is implemented in a proprietary all digital method. The ASM3X2105A modulates the output of a single PLL in order to "spread" the bandwidth of a synthesized clock, and more importantly, decreases the peak amplitudes of its harmonics. This results in significantly lower system EMI compared to the typical narrow band signal produced by oscillators and most frequency generators. Lowering EMI by increasing a signal's bandwidth is called `spread spectrum clock generation'.
Product Description
The ASM3X2105A is a versatile spread spectrum frequency modulator designed specifically for input clock frequencies from 6MHz to 12MHz. The ASM3X2105A can generate an EMI reduced clock from crystal, ceramic resonator, or system clock. The ASM3X2105A offers frequency deviation of 1%. The ASM3X2105A reduces electromagnetic interference (EMI) at the clock source, allowing system wide reduction of EMI of down stream clock and data dependent
Applications
The ASM3X2105A is targeted towards EMI management for high speed digital applications such as PC peripheral devices, consumer electronics and embedded controller systems.
Block Diagram
SR0
SSON#
VDD
DIV2
Modulation XIN Crystal Oscillator XOUT Feedback Divider Frequency Divider
PLL
Phase Detector
Loop Filter
VCO
Output Divider
MODOUT
VSS
Alliance Semiconductor 2575, Augustine Drive * Santa Clara, CA * Tel: 408.855.4900 * Fax: 408.855.4999 * www.alsc.com
Notice: The information in this document is subject to change without notice.
October 2003 rev 1.0
Pin Configuration
ASM3X2105A
XIN /CLK XOUT DIV2 VSS
1
8
VDD MODOUT SSON# SR0
2
7
ASM3X2105A
3 6
4
5
Pin Description Pin# 1 2 3 4 5 6 7 8 Pin Name XIN/CLK XOUT DIV2 VSS SR0 SSON# MODOUT VDD Type I O I P I I O P Description Crystal connection or external reference frequency input. This pin has dual functions. It can be connected to either an external crystal or an external reference clock. Crystal connection. If using an external reference, this pin must be left unconnected. Digital logic input used to select normal output mode or divide-by-2 output mode. When this pin is HIGH, the frequency of the output clock is the same as the input clock frequency. When it is tied LOW, the output frequency is half the input clock frequency. This pin has an internal pull-up resistor. Ground to entire chip. Digital logic input used to select Spreading Range (Refer Spread Deviation Table). This pin has an internal pull-up resistor. Digital logic input used to enable Spread Spectrum function (Active LOW). Spread Spectrum function enabled when LOW, disabled when HIGH. This pin has an internal pull-low resistor. Spread spectrum low EMI output. Power supply for the entire chip (5V).
Spread Deviation Table SR0 1 0 Spread Deviation (%) 1 Reserved
Low Frequency EMI Reduction
Notice: The information in this document is subject to change without notice.
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October 2003 rev 1.0
Spread Spectrum
ASM3X2105A
Spreading the spectrum of the signal reduces the system EMI. The optimal setting should minimize system EMI to the fullest without affecting system performance. The spreading is described as a percentage deviation of the center frequency (Note: The center frequency is the frequency of the external reference input on CLKIN, Pin1). Example: The ASM3X2105A is designed for communications, digital video and imaging applications. It is not only optimized for operation in the 6MHz - 12MHz range, but its output frequency can be extended down to one half of the input clock frequency using the divide-by-two feature. This feature extends low frequency operation to as low as 3MHz. Setting pin 3 low (DIV2=0; divide-by-two mode) sets the output frequency (MODOUT) to half the frequency of the input clock (CLKIN). This is a simple way to generate a spread spectrum modulated low frequency clock when only a higher frequency signal is available. If you want the output frequency to be the same as the input, you can either set DIV2=1 or leave it unconnected.
+5V
8.832MHz Crystal
1
CLKIN XOUT DIV2 VSS
VDD MODOUT SSON# SR0
8
2
7
0.1F
3 6
4
5
Modulated 4.416MHz is connected to CLK input pin of the system
ASM3X2105A
Low Frequency EMI Reduction
Notice: The information in this document is subject to change without notice.
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October 2003 rev 1.0
EMC Software Simulation
ASM3X2105A
By using Alliance's proprietary EMC simulation software - EMI-Lator(R), radiated system level EMI analysis can be made easier, allowing quantitative measure on the benefits of Alliance's EMI reduction products. The simulation engine of this EMC software has already been characterized to correlate with the electrical characteristics of Alliance EMI reduction ICs. The figure below is an illustration of this simulation result. Please visit our website at www.alsc.com for information on how to obtain a free copy and demonstration of EMI-Lator (R).
Simulation results From EMI-Lator(R)
Low Frequency EMI Reduction
Notice: The information in this document is subject to change without notice.
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October 2003 rev 1.0
ASM3X2105A
Absolute Maximum Ratings Symbol VDD, VIN TSTG TA Parameter Voltage on any pin with respect to GND Storage temperature Operating temperature Rating -0.5 to + 7.0 -65 to +125 Unit V C
0 to 70 C Note: These are stress ratings only and functional operation is not implied. Exposure to absolute maximum ratings for extended periods may affect device reliability.
DC Electrical Characteristics Symbol VIL VIH IIL IIH IXOL IXOH VOL VOH ICC IDD VDD tON ZOUT Input low voltage Input high voltage Input low current (pull-up resistors on inputs SR0 and DIV2) Input high current (pull-down resistor on input SSON#) XOUT output low current (@ 4.0V, VDD = 5V) XOUT output high current (@2.5V, VDD = 5V) Output low voltage (VDD = 5V, IOL = 20mA) Output high voltage (VDD = 5V, IOH = 20mA) Dynamic supply current normal mode (5V, 8MHz and 15pF loading) Static supply current standby mode Operating voltage Power up time (first locked clock cycle after power up) Clock out impedance 2.5 40 40 4.75 5.0 0.18 50 5.25 Parameter Min GND - 0.3 2.0 Typ 44 66 3 3 0.4 Max 0.8 VDD + 0.3 Unit V V A A mA mA V V mA A V mS
Low Frequency EMI Reduction
Notice: The information in this document is subject to change without notice.
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October 2003 rev 1.0
AC Electrical Characteristics Symbol fIN MODOUT tLH* tHL* tJC Input frequency Output frequency Output rise time (measured at 0.8V to 2.0V) Output fall time (measured at 2.0V to 0.8V) Jitter (cycle to cycle) Parameter
ASM3X2105A
Min 6 6 -
Typ 440 300 50
Max 10 10 360 55
Unit MHz MHz ps ps ps %
tD Output duty cycle 45 * VDD = +5V, Input Frequency = 8MHz, tLH and tHL are measured into a capacitive load of 15pF
Low Frequency EMI Reduction
Notice: The information in this document is subject to change without notice.
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October 2003 rev 1.0
Package Information
ASM3X2105A
8-Pin SOIC (Pb Free Parts)
E
H
D
A2
A
e B A 1
C L
D
Symbol
Dimensions in inches Min Max 0.071 0.010 0.069 0.020 0.01 0.202 0.164
Dimensions in millimeters Min 1.45 0.10 1.35 0.31 0.10 4.72 3.75 Max 1.80 0.25 1.75 0.51 0.25 5.12 4.15 1.27 BSC 5.70 0.30 0 6.30 0.70 8
A A1 A2 B C D E e H L
0.057 0.004 0.053 0.012 0.004 0.186 0.148
0.050 BSC 0.224 0.012 0 0.248 0.028 8
Low Frequency EMI Reduction
Notice: The information in this document is subject to change without notice.
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October 2003 rev 1.0
ASM3X2105A
8-Pin TSSOP
H
E D A2 A e B A1 L C
Dimensions in inches Symbol A A1 A2 B C D E e H L Min 0.047 0.002 0.031 0.007 0.004 0.114 0.169 0.006 0.041 0.012 0.008 0.122 0.177 Max
Dimensions in millimeters Min Max 1.10 0.05 0.80 0.19 0.09 2.90 4.30 0.65 BSC 6.20 0.45 0 6.60 0.75 8 0.15 1.05 0.30 0.20 3.10 4.50
0.026 BSC 0.244 0.018 0 0.260 0.030 8
Low Frequency EMI Reduction
Notice: The information in this document is subject to change without notice.
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October 2003 rev 1.0
Ordering Codes Part Number ASM3X2105AFTR ASM3X2105AFT ASM3X2105AFSR ASM3X2105AFS Package 8-PIN TSSOP 8-PIN TSSOP 8-PIN SOIC 8-PIN SOIC
ASM3X2105A
TAPE AND REEL TUBE TAPE AND REEL TUBE
Device Ordering Information
ASM3X2105AFTR
OR - SOT23/T/R TT - TSSOP, TUBE TR - TSSOP, T/R VT - TVSOP, TUBE VR - TVSOP, T/R ST - SOIC, TUBE
SR - SOIC, T/R QR - QFN, T/R QT - QFN, TUBE BT - BGA, TUBE BR - BGA, T/R
F = Pb FREE
PART NUMBER
X = Automotive
I = Industrial
P or n/c = Commercial
1 - reserved 2 - Non PLL based 3 - EMI Reduction 4 - DDR support products 5 - STD Zero Delay Buffer
6 - power management 7 - power management 8 - power management 9 - Hi performance 0 - reserved
Alliance Semiconductor Mixed Signal Product
Low Frequency EMI Reduction
Notice: The information in this document is subject to change without notice.
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October 2003 rev 1.0
ASM3X2105A
Alliance Semiconductor Corporation 2595, Augustine Drive, Santa Clara, CA 95054 Tel# 408-855-4900 Fax: 408-855-4999 www.alsc.com
Copyright (c) Alliance Semiconductor All Rights Reserved Preliminary Information Part Number: ASM3X2105A Document Version: v1.0
(c) Copyright 2003 Alliance Semiconductor Corporation. All rights reserved. Our three-point logo, our name and Intelliwatt are trademarks or registered trademarks of Alliance. All other brand and product names may be the trademarks of their respective companies. Alliance reserves the right to make changes to this document and its products at any time without notice. Alliance assumes no responsibility for any errors that may appear in this document. The data contained herein represents Alliance's best data and/or estimates at the time of issuance. Alliance reserves the right to change or correct this data at any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or customer. Alliance does not assume any responsibility or liability arising out of the application or use of any product described herein, and disclaims any express or implied warranties related to the sale and/or use of Alliance products including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to in Alliance's Terms and Conditions of Sale (which are available from Alliance). All sales of Alliance products are made exclusively according to Alliance's Terms and Conditions of Sale. The purchase of products from Alliance does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellectual property rights of Alliance or third parties. Alliance does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of Alliance products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify Alliance against all claims arising from such use.
Low Frequency EMI Reduction
Notice: The information in this document is subject to change without notice.
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